PBGA

常见例句

At the same time,experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
中文摘要目前一般封装体之封装材料，即使是同一厂商所制造出相同名称的产品，其材料性质亦有差异存在，因此探讨材料性质变异对于封装体的影响是有其必要性的。
PBGA (plastic ball grid array) assembly
PBGA组件
Optimization Design of Astronomic PBGA Solder Joint under Shock Load
冲击载荷下航天用PBGA焊点的优化设计
The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
PBGA中环氧模塑封装材料的热力学应力分析
The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life
PBGA焊点热疲劳寿命的正交试验及回归分析