wafer-level

常见例句

• One should cover the resistance with metal layer, to avoid the damaged during the wafer level testing.
  用金属覆盖电阻,避免wafer级测试时的损伤。
• Structure designing and key processing technologies for wafer level package(WLP) were studied.
  对圆片级封装(WLP)的结构设计和关键工艺技术进行了研究;
• Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level.
  静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
• Research of gold bump for wafer level package
  用于圆片级封装的金凸点研制
• Ultrathin Wafer Level Chip Size Package Technology
  超薄型圆片级芯片尺寸封装技术
• Wafer Level Die Attach Film (WLDAF) Lamination
  晶圆级芯片贴装薄膜贴覆
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