flip-chip technology

基本解释

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
论述了如CSP、BGA 及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.
倒装技术是发展的关键技术，它包括再分布技术、凸点底层金属（UBM）技术、凸点制备技术、倒扣焊接技术和底部填充技术等。