ball-grid

基本解释

Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊点阵列封装需要倒装焊。
In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height.
在这个例子里，球栅阵列(BGA)焊膏沉积面积正常，但实际焊膏量大于期望量和期望高度的2倍。
Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).
钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process.
中文摘要本文针对阵列锡球封装产品基板和胶饼间所产生的分层作研究。