die-attach

基本解释

Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
Specially set structure and attach fine-adjustment protection device, flexible adjustments height and force of cutting, can prolong service life of cutting die and cutting rubber board.
特有设定构造，附微调保护装置，灵活调设裁断高度和裁断力度，能延长刀模和裁断板的使用寿命。