high-aspect-ratio

基本解释

A novel pressure sensor based on a high-aspect-ratio structure formed by SU-8 photoresist is proposed.
主要提出了一种利用SU-8光刻胶形成高深宽比结构的新型压力传感器。
Recently, lithograph of thick resist has been regarded as an effective and economical technology for manufacturing excellent high-aspect-ratio microstructures (HARMS).
近年来，作为制作优质大高宽比微结构的厚层抗蚀剂光刻术以其工艺简单、制作成本低等优点受到国际上广泛重视。
With the rapid development of MEMS, being the first choice photoresist for the fabrication of high-aspect-ratio structure, SU-8 photoresist has been widely applied to the research field of MEMS.
随着微机电系统（MEMS）的迅速发展，SU-8光刻胶作为制作高深宽比结构的首选胶，已经被广泛地应用于MEMS研究领域。

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